Recently, the CIM system of the IC carrier board factory of Wuhan Xinchuanyuan Semiconductor Co., Ltd. was successfully launched, marking the first breakthrough in the CIM of the carrier board intelligent manufacturing factory. This project covers core production systems such as MES, EAP, QMS, WMS, and PMS, and is implemented and launched by the team of Shanghai Glorysoft Software Co., Ltd., creating an efficient and intelligent production management platform for Xinchuanyuan and injecting new vitality into the IC carrier board industry in China from the aspects of intelligence and digitization.
IC carrier board, as the core material for chip packaging, has an irreplaceable strategic position in the entire semiconductor industry chain. Currently, the market share of domestic manufacturers in IC carrier board is less than 5%, and the future market potential is huge. At the 7th China System - Level Packaging Conference (SiP China), one of the important activities in the global Chiplet and SiP advanced packaging fields, Xinchuanyuan first announced the application and breakthrough of ion implantation coating technology in carrier board, simplifying the traditional 2.5D packaging solution to a more efficient 2D packaging, shortening the packaging process and significantly reducing the cost. It has fundamentally solved the problem of the bonding force of smooth surfaces of multiple materials.
Highlights of the Xinchuanyuan CIM Project
1. High - Efficiency Integration of Multiple Systems:
By integrating multiple heterogeneous systems such as ERP, MES, EAP, QMS, WMS, PMS, RCS, and OA, full - process traceability and automated handling are achieved, further promoting the in - depth integration of production process automation and information technology. This integration has significantly reduced the packaging and testing costs.
2. Benchmark for a New IC Carrier Board Factory:
Glorysoft assisted Xinchuanyuan in the selection and planning of early - stage automation equipment suppliers, introduced industry - leading equipment suppliers, and completed the delivery of a fully automated production project for a pick - and - place board machine. The implementation of AGV to transport multiple BOXes and simultaneously load them onto the machine for continuous production has greatly improved the production efficiency.
3. Throughput and Traceability of the Entire Production Process:
The entire process from work order creation, process loading and unloading to packaging and shipping is completed, and anti - error and traceability mechanisms for modules such as materials, tools, line control, formulas, first pieces, and E - Mapping are realized, ensuring the precise control of the production process.
4. Excellent Project Management:
During the entire project process, document management is standardized, processes are compliant, the project cycle is accurately controlled, and the customer satisfaction rate is 100%, and a letter of praise has been issued to the Glorysoft project team. This project has set an excellent example for the intelligent construction of carrier board factories.
Project Team
During the project implementation process, a freezing rain disaster occurred, but the Glorysoft team was not afraid of the cold and entered the factory to ensure a smooth delivery.
With the help of the Glorysoft intelligent manufacturing system, Xinchuanyuan has successfully attracted the attention of industry - leading terminal customers and established a long - term and stable cooperative relationship. Looking ahead, Glorysoft will continue to adhere to the innovation spirit and work hand in hand with partners to explore the infinite possibilities of intelligent manufacturing and contribute to the development of the IC carrier board industry.
