Semiconductor-Glorysoft (Shanghai) Co.,Ltd.
Semiconductor

Semiconductor

Semiconductor 300mm

Materials, Wafers

Semiconductor Assembly and Testing

Semiconductor 300mm Industry Key Pain Points and Challenges

The process is delicate (the most high-end process), the process is complex (process length of 1000-3000 steps, rework and experimental batch control logic is complex), the equipment is highly automated, and the dependence on the system is very high.

In order to avoid the impact of manual handling yields, 300mm wafer fabs are generally equipped with OHT handling system, the requirements of fully automated handling system is very high on the work step and in-process control needs to be more detailed, such as in-process traceability, Q-Time control, etc. from the Lot level to the depth of the Wafer level, Lead to high requirements of system's performance and stability .

Fully automated handling and real-time dispatching needs to coordinate a variety of operating modes of equipment, including Inline lithography equipment Batch operation equipment, Sorter equipment, multi-cavity equipment, etc., but also to automatically deal with a variety of abnormalities, the need to connect APS, RTD, MES, MCS, EAP APC, FDC, YMS and other CIM systems to achieve light-off factory, the complexity is extremely high.

半导体材料、晶圆

We Offer

The industry's highest level of full automation system, from equipment production control, complex process control to automated labor handling, comprehensive coverage of various automation scenarios.

The whole set of CIM system and solution has been verified by the 300mm production line, and the performance and stability fully meet the requirements of the increasingly high standard production line.

Integrate multiple CIM systems, provide excellent full product line solutions, including self-developed APS, RTD, MES, MCS, EAP, APC, FDC, YMS, etc., help to create a light-off factory.

Gathering senior industry consultants from many companies in the industry (TSMC, UMC, SMIC, Applied Materials, etc.), we provide purely localized 300mm semiconductor CM system.

Industry Application Solutions

Glorysoft Fully Autonomous Automated Logistics Products

哥瑞利全⾃主⾃动化物流产品 哥瑞利全⾃主⾃动化物流产品

Automation scenarios and solutions for 300mm semiconductor equipment that have been validated on the production line

12寸半导体设备自动化场景和方案

12寸半导体设备自动化场景和方案

Materials, Wafer Industry Key Pain Points and Challenges

Difficulties in production process management: production data management is difficult, insufficient production process monitoring, material management is rough,  difficulties in quality traceability. Different perceptions of the system planning, 6-inch manual operation-based, 8-inch need Semi-auto, 12-inch need to go beyond the Semi-Auto, based on customer situation to do a good job of long-term planning. The nature of the R & D process flexibility, Recipe management has specific requirements, Big Company CIM products are relatively mature, but the price is high,  due to polictical impact , the software is easy to be sanctioned and after-sales service cannot be guaranteed.

半导体12寸

CIM Solutions for Semiconductor Materials

半导体材料CIM解决方案

Semiconductor Foundry CIM Solutions

300mm semiconductor CIM system framework with MES as the core pivot

半导体材料CIM解决方案

Key Pain Points and Challenges in the Semiconductor Packaging and Testing Industry

半导体封测

Complex Management of Multi-Customer, Multi-Variant, and Small Batch Orders

The industry involves managing orders from multiple customers with diverse product variants and small batch sizes, resulting in intricate order and production management.

Strict Verification and Traceability for Materials and Work Orders

Ensuring rigorous verification and traceability of materials and work orders is critical, as any misstep can lead to quality issues and affect downstream processes.

Tail-End Management for Outsourced Orders

Managing the tail-end of outsourced orders is challenging. A precise strategy must be implemented to ensure that each work order has exactly one tail-end batch, avoiding multiple leftover items.

Low Yield Alarms and Die Attach Rate Control

Monitoring low yield at different process stages and controlling the die attach rate are essential for maintaining production quality and efficiency.

Batch Management Strategy for Testing

While packaging processes are typically conducted in small batches for flexibility, testing is often performed in larger batches. A strategic approach is needed to manage testing batches effectively.

Packaging Strategy to Address Mixing and Mispackaging Issues

Defining capacities for trays, boxes, and cartons is crucial to prevent issues like mixed or incorrect packaging, which can impact downstream processes and product delivery.

Sampling and First Article Management

The diverse sampling and first article management methods require systematic control to ensure orderly execution, which helps maintain product quality and compliance.

Shift Handover and Piece-Rate Wage Management

Issues related to piece-rate wages for production staff can be mitigated through systematic shift handover management, ensuring accurate and fair compensation.

Scenarios with Single Wafer Being Referenced by Multiple Work Orders

Managing situations where a single wafer is temporarily used by multiple work orders and consumed in different steps requires sophisticated tracking and control mechanisms.

Integration of Grinding and Packaging Processes

Addressing scenarios where multiple types of wafers are sliced and introduced into the packaging line, ensuring proper machine usage and sequence alignment.

Yield Control by BIN for Final Testing (FT)

Implementing yield control by BINs for FT test results (SYL/SBL) is essential for accurately categorizing and tracking product quality.

IGBT Automotive-Grade High-Volume Production Single-Item Flow Traceability

Achieving detailed single-item flow traceability in high-volume production of automotive-grade IGBTs ensures compliance with stringent quality standards and regulatory requirements.

Solution

Traditional Packaging & Testing MES, EAP, RCM, RPA, PDA

Automated Logistics Management MCS/AGV

Bonding Goldenrecipe wire management

Scribe-to-tool RPA

Advanced Packaging CIM, RPA, FDC

E-Mapping and Defect Management DMS

Bonding program simulation

SMD Mapping Alignment Machine RPA

Real Time Dispatch RTD

High-end sealed single-piece flow traceability ULTS

FT/CP RTM

Final Test Document Parsing RPA

Advanced Production Scheduling APS

Test Production Management TMS

CP automatic needle setting, needle mark detection RPA

Automatic RPA generation for seal documents

Industry Application Solutions

FT Test Automation Management

Test equipment cannot be automated

Test results cannot be analyzed in real time

Test process cannot be controlled in real time

FT RPA

Scanning Lot ID + Device ID, integrated with MES to realize.

Automatic MES accounting (inbound/outbound).

Equipment downtime warning, reminding personnel to check.

Handler auto-call Recipe, key parameter validation.

Handler production data collection (Bin1-8).

Tester automatically enters parameters, checksums.

Tester automatically fetches the test program.

Tester test data (Datalog) automatically saved and uploaded.

SYL/SBL/PAT/SITEGAP/Data Comparison/Data Retention

Lot Yield Control (SYL)

Hardware, software BIN, test item control (SBL)

Part Average Test Control (PAT/DPAT)

Control of total yield variance value of each test station

Test data comparison (total number of tests, number of good, number of defective, number of batches)

Test Data Save Naming Configurable

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