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EAP - Equipment Automation System
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Industrial Internet-based Equipment Connectivity
Semiconductor front-end overall automated production equipment, including CVD, PVD, lithography, ETCH, WET, IMP, test equipment, thereby enhancing equipment productivity (OEE), reducing equipment maintenance costs, reducing equipment energy consumption, real-time monitoring and adjustment of equipment, equipment and production of the whole process of data collection. Connecting MES and related production information systems, realizing cross-platform data integration, breaking data barriers and solving equipment data silos.
Improvement of Production Operations Based On Industrial Big Data
Only historical data are analyzed and processed, and preventable maintenance and improvement of equipment and production are carried out through the analysis of basic data, so as to enhance the efficiency of production operations, improve the process flow and reduce production costs. Through multi-dimensional real-time and historical big data analysis mining and perspective, it provides a full range of data analysis and decision-making support for the company's decision-making, production operations, equipment management, field management, and lays a solid foundation for the realization of semiconductor forehearth industry 4.0 and smart factory.
Quality and Customer Satisfaction Improvement
It meets the customer's requirement for complete and comprehensive traceability of the site, significantly improves the quality of production by extracting and analyzing real quality data, and enhances customer satisfaction and the brand value and competitiveness of the semiconductor front-end.
EAP
Equipment Automation Systems
DC
Center for Data Acquisition
BC/LC
Production Management Information Management system
MCS
Logistics Control Management System
TMS
Management System
GlorysoftEAP©is a factory automation system that caters to semiconductor front-end and sealing and testing, bridging the gap between semiconductor equipment and upstream systems.
SECS
PLC
RV
DOS Sharing
EAP Daemon
MQ
Semiconductor
Display
PCB
Solar
Equipment Software
Data Collection Platform
DC can get the status/alarms/equipment operation parameters/board information of the equipment through various methods such as protocol reporting/file/database etc. and analyze and forward to other systems according to the corresponding rules. And according to the corresponding rules, it can be analyzed and forwarded to other systems. It can also control the range of device parameters according to the configuration for real-time monitoring.
Key Features
Document Collection
Protocol Acquisition
Database Collection
Parameter Check and Alarm
1. Data Connection Management
Includes modules for data protocol connection settings, document collection settings, etc.
Data connection protocol settings: can be configured to achieve PLC (OPC), SECS, HTTP, SOCKET, KAFKA, RV, RabbitMQ these protocols, to establish a connection; and can control the collection frequency.
Equipment sending control settings: can be configured to realize the conversion between multiple systems and multiple protocols to achieve automatic control of equipment parameters sent.
Document collection settings: Configurable markup collection templates can be configured to automatically collect similar document data into the database at regular intervals according to the markup.
Database collection settings: source database tables and target database tables can be configured to realize collection through scheduling.
2. Data Conversion Storage Settings
Contains modules for message mapping settings, message storage settings, etc;
Message Mapping Settings:self-service retrieval and configuration of messages from various sources, support for message splitting/merging/converting, etc.
Message Storage Settings:Self-configuration of multiple messages, associated message to data table storage settings, Scada data settings, different storage settings for the same message, etc.
Supports one-click auto-generation of configurations, no need for manual operation
3. Data Display
Automatically and intuitively monitor the operation of all equipment in the plant in real time, and monitor the operation of the product Wafer.
4. External Data Services
Includes the ability to provide upstream third-party systems with unavailable data, and through the northbound functionality can be configured to enable multiple storage and forwarding of data (http/kafka), etc.
Advantages of DC
Abundant collection methods
Supports industry standard data acquisition protocols and internet standard data transmission protocols
SemiconductorDisplayPCBSolar
Lithium
BC/LC is an information management system for production management. The system realizes data collection, transmission, process automation control, etc. through equipment and upper system such as MES. It reduces manpower and increases production capacity through systematic solutions. The system is mainly widely used in semiconductor, LCD, PCB, photovoltaic and other industries.
BC/LC System Architecture Description
BC/LC System Features
SemiconductorDisplayPCBSolar
Product White Papers
BC/LC-Production Management Informatization Management System
Video Demonstration
BC/LC-Production Management Informatization Management System
SemiconductorDisplayPCBSolarEquipment Software
TMS software is the business sub-system of EAP platform. Through TMS software, you can monitor the test process and test results of test equipment in real time, and summarize and analyze the test results to achieve real-time yield control and low
yield downtime of customer demand. Meanwhile, TMS can report the analyzed and integrated data to MES system according to the business requirements, and provide test data query and chart analysis.
TMS is mainly used for test data analysis, analysis, charting, reporting and other routine functions; it can be extended to test yield control real-time alarm and traceability functions.
Test Data Recording: Report test inbound through downstream equipment, as well as actively parsing test data when outbound and storing it in a unified manner.
Test data details: Provide a unified format to view the Summary file, including the number, description of the bin, and the machine name, etc., a simple and unified interface can help employees quickly onboarding and engineering staff quick data query.
Uploading and downloading: It can actively parse the last test file and download the already parsed test file.
Chart Data: Detailed display of test data, including file information, test items, charts, and BIN MAP diagrams.
File information: the main information of the parsed file.
Test Item: The test file contains a detailed presentation of each test item.
Chart: According to the test item has been tested by the value, histogram, box plot, trend graph, heat map, scatter plot and other charts to show the way available more just observe the test data statistics.
BIN MAP: Display SBin, HBin graphical data, more intuitively show the coordinates of Fail, Pass and other test particles.
SemiconductorDisplayPCBSolarEquipment SoftwareLithium
